Research Engineer/Senior Research Engineer (Flip Chip Bonding), Ime

As a Heterogeneous Integration Engineer, candidate will play a pivotal role in integrating modules, utilizing a wide spectrum of integration processes such as pick & place and flip chip bonding to assemble multiple components into a functional module. Additionally, you will be involved in encapsulating the modules to withstand reliability tests. This is an exceptional opportunity to work with state-of-the-art heterogeneous integration equipment, engage in ground-breaking research, and explore the frontiers of advanced electronics modules.Key responsibilities for this role include:Process development: Drive the advancement of various heterogeneous integration processes such as pick & place, flip chip bonding, underfill, solder ball attachment, and encapsulation. Your focus will be on achieving high reliability for electronic modules. This includes evaluating processing materials, executing "design of experiments" (DoE), performing metrology inspections, and reporting including data analysis.Intellectual property and know-how development:Seize the opportunity to conceptualize and develop intellectual properties and valuable know-how that aligns with industry needs.Job Requirements:Degree/Master in Materials Science, Mechanical, Manufacturing, Chemical or Chemistry, and Electrical or Electronics.2 to 3 years' experience in semiconductor processes such as pick & place, flip chip & encapsulation will be added advantage.Fresh graduate is welcome to applied for this position of "Heterogeneous Integration Engineer".Strong communication, industry awareness, and problem-solving skills.Highly motivated to succeed, a self-starter who is driven and able to work with others effectively to get things done.Company information Registration No.T08GB0002CReport this job advert Don't provide your bank or credit card details when applying for jobs.Researching careers? Find all the information and tips you need on career advice.#J-18808-Ljbffr